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{"id":7502386921625,"title":"1 Piece Aluminum Heatsink Heat Sink Cooler Fin Heat Diffusion Cooling Fin for High Power LED Amplifier Transistor IC Module Heatsink Size 150mm x 70mm x 11mm","handle":"1-piece-aluminum-heatsink-heat-sink-cooler-fin-heat-diffusion-cooling-fin-for-high-power-led-amplifier-transistor-ic-module-heatsink-size-150mm-x-70mm-x-11mm","description":"\u003ch3\u003e1 Piece Aluminum Heatsink Heat Sink Cooler Fin Heat Diffusion Cooling Fin for High Power LED Amplifier Transistor IC Module Heatsink Size 150mm x 70mm x 11mm\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eSpecifications Quantity: 1 piece heatsink Material: Aluminum Heatsink Size:\n150mm x 70mm x 11mm\/5.9 inches x 2.75 inches x 0.43 inch Color: black\nSpecifications Made of high quality black anodized Aluminum, provides great\nthermal conductivity and gives your a fascinating appearance. Multiple cooling\nfin design can effectively reduce the risk of hardware failure and power loss\ndue to overheating. Maximize surface area designed in contact with the cooling\nair. The 252 pieces cooling fins increase the area of the board and thus\nprovide for greater heat transfer. 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Multiple cooling\nfin design can effectively reduce the risk of hardware failure and power loss\ndue to overheating. Maximize surface area designed in contact with the cooling\nair. The 252 pieces cooling fins increase the area of the board and thus\nprovide for greater heat transfer. Applications: these aluminum heatsinks are\nwidely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage\nRegulator, MOSFET, SCR, high-power semiconductor devices, etc.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003ePackage Include: 1 piece Aluminum heatsink, the heatsink size is 150mm x 70mm x 11mm\/ 5.9 x 2.75 x 0.43 inch, Please make sure that the size of the heat sink fits that of your components.\u003c\/li\u003e\n \u003cli\u003eMade of high quality black anodized Aluminum, provides great thermal conductivity and gives your a luxurious appearance.\u003c\/li\u003e\n \u003cli\u003eMultiple cooling fin design can effectively reduce the risk of hardware failure and power loss due to overheating.\u003c\/li\u003e\n \u003cli\u003eMaximize surface area designed in contact with the cooling air. The 252 pieces cooling fins increase the area of the board and thus provide for greater heat transfer.\u003c\/li\u003e\n \u003cli\u003eApplications: these aluminum heatsinks are widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR, high-power semiconductor devices, etc.\u003c\/li\u003e\n \u003c\/ul\u003e\n\u003chr class=\"py-vbody\" style=\"display: none\"\u003e\n\n\n"}

1 Piece Aluminum Heatsink Heat Sink Cooler Fin Heat Diffusion Cooling Fin for High Power LED Amplifier Transistor IC Module Heatsink Size 150mm x 70mm x 11mm

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1 Piece Aluminum Heatsink Heat Sink Cooler Fin Heat Diffusion Cooling Fin for High Power LED Amplifier Transistor IC Module Heatsink Size 150mm x 70mm x 11mm

Specifications Quantity: 1 piece heatsink Material: Aluminum Heatsink Size: 150mm x 70mm x 11mm/5.9 inches x 2.75 inches x 0.43 inch Color: black Specifications Made of high quality black anodized Aluminum, provides great thermal conductivity and gives your a fascinating appearance. Multiple cooling fin design can effectively reduce the risk of hardware failure and power loss due to overheating. Maximize surface area designed in contact with the cooling air. The 252 pieces cooling fins increase the area of the board and thus provide for greater heat transfer. Applications: these aluminum heatsinks are widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR, high-power semiconductor devices, etc.

Product Features

  • Package Include: 1 piece Aluminum heatsink, the heatsink size is 150mm x 70mm x 11mm/ 5.9 x 2.75 x 0.43 inch, Please make sure that the size of the heat sink fits that of your components.
  • Made of high quality black anodized Aluminum, provides great thermal conductivity and gives your a luxurious appearance.
  • Multiple cooling fin design can effectively reduce the risk of hardware failure and power loss due to overheating.
  • Maximize surface area designed in contact with the cooling air. The 252 pieces cooling fins increase the area of the board and thus provide for greater heat transfer.
  • Applications: these aluminum heatsinks are widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR, high-power semiconductor devices, etc.