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Specifications:\n100% Brand New High Quality Material: Aluminum Fins: 26 Size: 5.9\"(L) x 3\"(W)\nx 1.1\"(H) \/150mm (L)x 80mm(W) x 27mm(H) Quantity: 1 Used for : Various mini DC\nconverter circuit board computer, Power Transistor, FET, IC, Power Amplifier,\nVoltage Regulator, MOSFET, SCR etc. Package: 1x Aluminum Heat Sink Cooling Fin\nNote: 1. Please check the specification table and make sure that the size of\nthe heatsink fits that of your component. Thank You! 2. Please allow 1-3mm\nerror due to manual measurement. Thanks for your understanding.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eMade of high quality Aluminum, good thermal conductivity\u003c\/li\u003e\n \u003cli\u003eReduce the risk of hardware failure due to overheating\u003c\/li\u003e\n \u003cli\u003eMaximize surface area Designed in contact with the cooling air. The 26 pcs fins increase the area of the board and thus provide for greater heat transfer\u003c\/li\u003e\n \u003cli\u003eWidely use for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.\u003c\/li\u003e\n \u003cli\u003eSize: 5.9\"(L) x 3\"(W) x 1.1\"(H) \/150mm(L)x 80mm(W) x 27mm(H). 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In computers, heat sinks are used to\ncool central processing units or graphics processors. Heat sinks are used with\nhigh-power semiconductor devices, where the heat dissipation ability of the\ncomponent itself is insufficient to moderate its temperature. Specifications:\n100% Brand New High Quality Material: Aluminum Fins: 26 Size: 5.9\"(L) x 3\"(W)\nx 1.1\"(H) \/150mm (L)x 80mm(W) x 27mm(H) Quantity: 1 Used for : Various mini DC\nconverter circuit board computer, Power Transistor, FET, IC, Power Amplifier,\nVoltage Regulator, MOSFET, SCR etc. Package: 1x Aluminum Heat Sink Cooling Fin\nNote: 1. Please check the specification table and make sure that the size of\nthe heatsink fits that of your component. Thank You! 2. Please allow 1-3mm\nerror due to manual measurement. Thanks for your understanding.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eMade of high quality Aluminum, good thermal conductivity\u003c\/li\u003e\n \u003cli\u003eReduce the risk of hardware failure due to overheating\u003c\/li\u003e\n \u003cli\u003eMaximize surface area Designed in contact with the cooling air. The 26 pcs fins increase the area of the board and thus provide for greater heat transfer\u003c\/li\u003e\n \u003cli\u003eWidely use for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.\u003c\/li\u003e\n \u003cli\u003eSize: 5.9\"(L) x 3\"(W) x 1.1\"(H) \/150mm(L)x 80mm(W) x 27mm(H). Please make sure that the size of the heat sink fits that of your component\u003c\/li\u003e\n \u003c\/ul\u003e\n\u003chr class=\"py-vbody\" style=\"display: none\"\u003e\n\n\n"}

WeiMeet Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Transistor Semiconductor Devices with 26 Pieces Fins 150mmx 80mm x 27mm

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WeiMeet Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Transistor Semiconductor Devices with 26 Pieces Fins 150mmx 80mm x 27mm

A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices, where the heat dissipation ability of the component itself is insufficient to moderate its temperature. Specifications: 100% Brand New High Quality Material: Aluminum Fins: 26 Size: 5.9"(L) x 3"(W) x 1.1"(H) /150mm (L)x 80mm(W) x 27mm(H) Quantity: 1 Used for : Various mini DC converter circuit board computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc. Package: 1x Aluminum Heat Sink Cooling Fin Note: 1. Please check the specification table and make sure that the size of the heatsink fits that of your component. Thank You! 2. Please allow 1-3mm error due to manual measurement. Thanks for your understanding.

Product Features

  • Made of high quality Aluminum, good thermal conductivity
  • Reduce the risk of hardware failure due to overheating
  • Maximize surface area Designed in contact with the cooling air. The 26 pcs fins increase the area of the board and thus provide for greater heat transfer
  • Widely use for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.
  • Size: 5.9"(L) x 3"(W) x 1.1"(H) /150mm(L)x 80mm(W) x 27mm(H). Please make sure that the size of the heat sink fits that of your component