Aluminum Heat Sink Heatsink,Cooler Cooling for Led Amplifier Transistor IC Module 11.81" x 5.51" x 0.78"
Aluminum Heat Sink Heatsink,Cooler Cooling for Led Amplifier Transistor IC Module 11.81" x 5.51" x 0.78"
Read more Description: A heat sink is a passive heat exchanger that transfers the heat generated by an electronic device, thereby allowing regulation of the device's temperature at optimal levels. This heat sink is used with high-power LED light, where the heat dissipation ability of the component itself is insufficient to moderate its temperature. Package Includes: 1 x LED Heat Sink Specifications: Material: AluminumSize: 30014020mm / 11.815.510.78"Fins: 19Quantity: 1Weight: 570g(approx.) Made of high quantity aluminum, good thermal conductivity. Reduce the risk of LED light failure due to overheating. Designed to maximize its surface area in contact with the cool air. Light weight and used in applications where weight is a big concern. Specially designed for high power household LED light or fish tank LED devices, etc. Fit for 8pcs 3W LEDs or 20pcs 1W LEDs. Read more Excellent material selection Aluminum alloy material is strong and durable, high gloss, not easy to corrosion, long service life Fast heat dissipation Aluminum base scientific heat dissipation structure heat dissipation effect is good Industrial treatment Electrophoretic oxidation, sandblasting oxidation, anodic oxidation and natural color, lamination and other surface treatments correspond to different situations Processing precision Milling, rounding, grooving and chamfering, milling plane work is carefully done to show the quality of the product Read more Read more Application Range: Widely used in LED, electric power industry, new energy vehicles, laser power supply, UPS power supply, inverter industry security, etc.
Product Features
- Material:Made of high quality Aluminum, good thermal conductivity, it is the first choice of heat dissipation materials
- The larger the surface area of the radiator, the better the cooling effect,the 19pcs fins increase the area of the board and thus provide for greater heat transfer
- It can reduce the power loss of the device,provide an effective volume of occupied space for the device and improve the environment
- Overall Size : 11.81"(L) x 5.51"(W) x 0.78"(H) / 300mm (L)x 140mm(W) x 20mm(H)
- Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.