ESUMIC Aluminum Heat Sink Heat Sink Module 16 Heat Sinks for high-Power Transistor semiconductor Devices 100x100x18mm and 1roll 20mm x 25m Double-Sided Adhesive Thermal Conductive Tape
ESUMIC Aluminum Heat Sink Heat Sink Module 16 Heat Sinks for high-Power Transistor semiconductor Devices 100x100x18mm and 1roll 20mm x 25m Double-Sided Adhesive Thermal Conductive Tape
Droduct description Specification : Cooler Material : Aluminum Color : silverProduct parameter introduction Heat sink spacing: 5mm. Number of fins: 16. Size: 100 100 18mm / 3.93 x 3.93 x 0.7 inches.Tape & Dimensions: 20mm x 25m x 0.25mm. & Working temperature: -20β~120β. & Thermal conductivity: 1.5.The package includes: π4 x 100x100x18mm aluminum radiator module. π1 x 12mm x 25m x 0.25mm thermally conductive double-sided tape.
Product Features
- Radiator moduleThe surface design minimizes cooling when in contact with air. 16 heat sinks increase the sealing area, thus ensuring better heat dissipation.
- ApplicationComputer, FET, IC, power amplifier, voltage regulator, MOSFET, SCR, etc. Make sure that the size and heat dissipation of the heat sink are suitable for your components.
- Tape characteristicshigh thermal conductivity, strong insulation, strong adhesion, softness, pressure resistance, heat resistance, double conductive tape, etc. It is a powerful assistant to solve the heat dissipation problem of many electronic products.
- Thermally conductive tape Thermally conductive tape has high thermal conductivity and insulation, and can be firmly connected to the radiator and IC chip.
- Easy to usejust stick to the surface of the object. Tear off the blue paper to firmly adhere to the heat source and radiator. Speed up heat dissipation.