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Total weight: 50 g, net weight of the paste: 40 g\u003c\/li\u003e_x000d_\n \u003cli\u003eHigh solderability: A powerful thixotropic agent is added to the solder to make the solder paste highly active. During the soldering process, the solder is significantly moistened, reducing the phenomenon of missoldering\u003c\/li\u003e_x000d_\n \u003cli\u003eLead-free solder paste: no cleaning, strong viscosity, bright welding point. Medium temperature soldering paste with flux, melting point: 138C (280F)\u003c\/li\u003e_x000d_\n \u003cli\u003ePRODUCT ADVANTAGES Push design for more smooth flowing, no waste when welding. Piston injection needle features: reflow soldering does not produce tin beads and tin bridges\u003c\/li\u003e_x000d_\n \u003cli\u003eApplications Low temperature tin is widely used in the repair of electronic products. Low temperature tin is mainly used for items that cannot withstand the high temperature of the device. 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Total weight: 50 g, net weight of the paste: 40 g\u003c\/li\u003e_x000d_\n \u003cli\u003eHigh solderability: A powerful thixotropic agent is added to the solder to make the solder paste highly active. During the soldering process, the solder is significantly moistened, reducing the phenomenon of missoldering\u003c\/li\u003e_x000d_\n \u003cli\u003eLead-free solder paste: no cleaning, strong viscosity, bright welding point. Medium temperature soldering paste with flux, melting point: 138C (280F)\u003c\/li\u003e_x000d_\n \u003cli\u003ePRODUCT ADVANTAGES Push design for more smooth flowing, no waste when welding. Piston injection needle features: reflow soldering does not produce tin beads and tin bridges\u003c\/li\u003e_x000d_\n \u003cli\u003eApplications Low temperature tin is widely used in the repair of electronic products. Low temperature tin is mainly used for items that cannot withstand the high temperature of the device. For example, electronic components that do not withstand high temperatures, LED soldering, PCB BGA CPU SMD maintenance\u003c\/li\u003e_x000d_\n \u003c\/ul\u003e"}

Gruiqrd Syringe Soldering Paste Flux Sn42 Bi58, Lead-Free Soldering Paste, Soldering Flux Tin Paste, Low Temperature Solder Paste 138 Degrees, for BGA LED SMD SMT Solder (1.41 oz/40 g)

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Gruiqrd Syringe Soldering Paste Flux Sn42 Bi58, Lead-Free Soldering Paste, Soldering Flux Tin Paste, Low Temperature Solder Paste 138 Degrees, for BGA LED SMD SMT Solder (1.41 oz/40 g)

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Product Features

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  • Gruiqrd Solder paste content: alloy tin 42% Bi58%, flux content: 10.5%. Total weight: 50 g, net weight of the paste: 40 g
  • _x000d_
  • High solderability: A powerful thixotropic agent is added to the solder to make the solder paste highly active. During the soldering process, the solder is significantly moistened, reducing the phenomenon of missoldering
  • _x000d_
  • Lead-free solder paste: no cleaning, strong viscosity, bright welding point. Medium temperature soldering paste with flux, melting point: 138C (280F)
  • _x000d_
  • PRODUCT ADVANTAGES Push design for more smooth flowing, no waste when welding. Piston injection needle features: reflow soldering does not produce tin beads and tin bridges
  • _x000d_
  • Applications Low temperature tin is widely used in the repair of electronic products. Low temperature tin is mainly used for items that cannot withstand the high temperature of the device. For example, electronic components that do not withstand high temperatures, LED soldering, PCB BGA CPU SMD maintenance
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