ArctiClean Kit 1 & 2 Thermal Paste Compound Remover + Arctic Silver 5 Thermal Compound Paste 3.5g + Lansh Tool
ArctiClean Kit 1 & 2 Thermal Paste Compound Remover + Arctic Silver 5 Thermal Compound Paste 3.5g + Lansh Tool
Arctic silver 3.5 g thermal compound with Lansh Tool Premium silver polysynthetic thermal compound, Use between CPUs and heatsinks or water-cooling solutions. Doesn't separate, run, migrate or bleed. 3.5 gram tube will cover 20 to 30 small cpus. You can use this in PLAYSTATION or XBOX. Thermal Material Remover Emulsifies and removes thermal compounds on pads. Saturate the thermal pad or compound with several drops and wait 30 to 60 seconds. Gently wipe to completely remove thermal material. Repeat if necessary. Always use Arcticlean 2 thermal surface purifier after using this product. Thermal surface Purifier To prepare surface for thermal interface material. Use Arcticlean 1 material remover to remove any thermal pad or compound prior to using this product. Repeat if necessary. Apply several drops to the thermal mating surface and wipe gently with a lint free cloth to dry. Apply thermal paste evenly Just put a drop in the center of the cpu and apply it evenly with the tool provided. Don't over apply as you only need a little bit. Read more
- Developed by Arctic Silver, one of the world experts in thermal compounds and heat transfer , Easy-to-apply bottles make the cleaning process easier than competing products
- Arctic Silver 5 contains over 88% thermally conductive filler by weight. In addition to micronized silver, Arctic Silver 5 also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles.
- Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
- 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core
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