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{"id":7109918687385,"title":"HY-700-50g Thermal Paste,CPU Paste;Heatsink Past;Thermal Compound; Conductivity: \u003e3.14W\/m-k Carbon Based High Performance, Heatsink Paste, Thermal Compound CPU for All Coolers - 50 Grams","handle":"hy-700-50g-thermal-paste-cpu-paste-heatsink-past-thermal-compound-conductivity-3-14w-m-k-carbon-based-high-performance-heatsink-paste-thermal-compound-cpu-for-all-coolers-50-grams","description":"\u003ch4\u003eHY-700-50g Thermal Paste,CPU Paste;Heatsink Past;Thermal Compound; Conductivity: \u0026gt;3.14W\/m-k Carbon Based High Performance, Heatsink Paste, Thermal Compound CPU for All Coolers - 50 Grams\u003c\/h4\u003e\n\u003cp id=\"b\"\u003eSpecially designed for overclocking Specially developed to\nmeet the demanding needs of the overclocking community. It exhibits excellent\nheat transfer performance and can fully exploit the capabilities of a high-\nperformance cooling system. In the nano-particulate structure, micronized\naluminum and zinc oxide contained in the paste interpolate slight unevenness\nof the heat medium such as CPU and the heat sink, and realize excellent\nthermal conductivity. The special compound that drying does not proceed even\nat high temperature of 80 ° C is performed, and it does not cure for a long\ntime and maintains stable characteristics. Also, there is no concern about\nshorts due to non-conductivity. Application spatula included Easy to use for\napplying grease, Read more Feature Nano particle structureFine-grained\naluminum and zinc oxide contained in the paste interpolate the slight\nunevenness of the heat medium such as CPU and the heat sink, achieving\nexcellent thermal conductivity. StabilityA special compound that does not dry\nat a high temperature of 80 ° C is used to maintain stable properties without\ncuring for a long time. Non-conductiveThere is no concern about shorts due to\nnon-conductivity. 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Conductivity: \u0026gt;3.14W\/m-k Carbon Based High Performance, Heatsink Paste, Thermal Compound CPU for All Coolers - 50 Grams\u003c\/h4\u003e\n\u003cp id=\"b\"\u003eSpecially designed for overclocking Specially developed to\nmeet the demanding needs of the overclocking community. It exhibits excellent\nheat transfer performance and can fully exploit the capabilities of a high-\nperformance cooling system. In the nano-particulate structure, micronized\naluminum and zinc oxide contained in the paste interpolate slight unevenness\nof the heat medium such as CPU and the heat sink, and realize excellent\nthermal conductivity. The special compound that drying does not proceed even\nat high temperature of 80 ° C is performed, and it does not cure for a long\ntime and maintains stable characteristics. Also, there is no concern about\nshorts due to non-conductivity. Application spatula included Easy to use for\napplying grease, Read more Feature Nano particle structureFine-grained\naluminum and zinc oxide contained in the paste interpolate the slight\nunevenness of the heat medium such as CPU and the heat sink, achieving\nexcellent thermal conductivity. StabilityA special compound that does not dry\nat a high temperature of 80 ° C is used to maintain stable properties without\ncuring for a long time. Non-conductiveThere is no concern about shorts due to\nnon-conductivity. Read more\u003c\/p\u003e \n\n\n \u003cul class=\"a\"\u003e\n \u003cli\u003eExcellent Thermal Conductivity:\u0026gt;3.14W\/(m-K)\u003c\/li\u003e\n \u003cli\u003eSilver color polysynthetic thermal paste grease\u003c\/li\u003e\n \u003cli\u003eHigh stability and reliability;Grease cleaner and applicator included\u003c\/li\u003e\n \u003cli\u003eOdorless, low oil content, non-volatile, non-corrosive, non-toxic, flame retardant;BAY Direct Thermal Paste perfect for CPU,VGA,LED,Chipset and other PC components.\u003c\/li\u003e\n \u003c\/ul\u003e"}

HY-700-50g Thermal Paste,CPU Paste;Heatsink Past;Thermal Compound; Conductivity: >3.14W/m-k Carbon Based High Performance, Heatsink Paste, Thermal Compound CPU for All Coolers - 50 Grams

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HY-700-50g Thermal Paste,CPU Paste;Heatsink Past;Thermal Compound; Conductivity: >3.14W/m-k Carbon Based High Performance, Heatsink Paste, Thermal Compound CPU for All Coolers - 50 Grams

Specially designed for overclocking Specially developed to meet the demanding needs of the overclocking community. It exhibits excellent heat transfer performance and can fully exploit the capabilities of a high- performance cooling system. In the nano-particulate structure, micronized aluminum and zinc oxide contained in the paste interpolate slight unevenness of the heat medium such as CPU and the heat sink, and realize excellent thermal conductivity. The special compound that drying does not proceed even at high temperature of 80 ° C is performed, and it does not cure for a long time and maintains stable characteristics. Also, there is no concern about shorts due to non-conductivity. Application spatula included Easy to use for applying grease, Read more Feature Nano particle structureFine-grained aluminum and zinc oxide contained in the paste interpolate the slight unevenness of the heat medium such as CPU and the heat sink, achieving excellent thermal conductivity. StabilityA special compound that does not dry at a high temperature of 80 ° C is used to maintain stable properties without curing for a long time. Non-conductiveThere is no concern about shorts due to non-conductivity. Read more

  • Excellent Thermal Conductivity:>3.14W/(m-K)
  • Silver color polysynthetic thermal paste grease
  • High stability and reliability;Grease cleaner and applicator included
  • Odorless, low oil content, non-volatile, non-corrosive, non-toxic, flame retardant;BAY Direct Thermal Paste perfect for CPU,VGA,LED,Chipset and other PC components.

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